On May 8, the official website of the Association of Trading Companies showed that 36 companies have announced the issuance of technology innovation bonds, with a total issuance scale of 21 billion yuan. Shenzhen supports companies to actively issue technology innovation bonds, and two companies are on the first batch of technology innovation bond issuance lists. Among them, Luxshare Precision Industry Co., Ltd. plans to issue 1 billion yuan of technology innovation bonds. The purpose of the raised funds is to optimize the company's debt structure, supplement the company's operating funds, and empower the construction of high-end intelligent manufacturing bases and digital manufacturing upgrades; Shenzhen Investment Holdings Co., Ltd. plans to issue a total of 1 billion yuan of technology innovation bonds with a term of 3 years and 10 years. The raised funds will be used specifically to invest in its parent funds, and invest in intelligent manufacturing, high-end equipment, semiconductors and integrated circuits, AI and embodied robots and other scientific and technological innovation fields, accurately matching the needs of "investing early, investing small, and investing for the long term".