TSMC's Chiayi Advanced Packaging AP7 plant was originally scheduled to receive equipment in the third quarter, but the supply chain has recently received notices that the equipment will be delayed until the fourth quarter. Two safety incidents occurred in the plant recently, causing it to stop working. The first phase of the plant will build wafer-level multi-chip module (WMCM) packaging capacity. It is speculated that this packaging technology will first be used in Apple's self-developed chips.